Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
€91.03
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plan (IEC 47/2169/CD:2013)
€128.22
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 47F/125/CD:2012)
€69.91
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 47F/128/CD:2012)
€63.27
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 47F/127/CD:2012)
€77.20
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass (IEC 47F/126/CD:2012)
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012.
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 47/2193/CD:2014)
€105.42
Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 47F/122/CD:2012)
€167.66
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage (IEC 47/2131/CD:2012)
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014)
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013)
€116.64
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 47F/177/CD:2013)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020.
