31.080.01 : Semiconductor devices in general

UNE-EN 60749-22:2004

UNE-EN 60749-22:2004

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Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength

€69.00

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UNE-EN 60749-36:2004

UNE-EN 60749-36:2004

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Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state

€36.00

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UNE-EN 60749-31:2004

UNE-EN 60749-31:2004

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Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)

€32.00

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UNE-EN 60749-32:2004

UNE-EN 60749-32:2004

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Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)

€36.00

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IEC 60749-33:2004

IEC 60749-33:2004

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Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

€44.00

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NF EN 60191-6-10, C96-013-6-10 (02/2004)

NF EN 60191-6-10, C96-013-6-10 (02/2004)

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Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-10 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Dimensions des boîtiers P-VSON

€77.67

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NF EN 60749-14, C96-022-14 (01/2004)

NF EN 60749-14, C96-022-14 (01/2004)

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Semiconductor devices - Mechanical and climatic test methods - Part 14 : robustness of terminations (lead integrity) - Dispositifs de semiconducteurs

€95.67

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BS EN 60749-14:2003

BS EN 60749-14:2003

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Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)

€193.00

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DIN EN 60749-36:2003-12

DIN EN 60749-36:2003-12

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Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003.

€41.78

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DIN EN 60749-1:2003-12

DIN EN 60749-1:2003-12

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Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003.

€56.17

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DIN EN 60749-31:2003-12

DIN EN 60749-31:2003-12

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Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003.

€34.30

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DIN EN 60749-22:2003-12

DIN EN 60749-22:2003-12

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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003.

€91.03

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DIN EN 60749-8:2003-12

DIN EN 60749-8:2003-12

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Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003.

€84.58

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NF EN 60749-25, C96-022-25 (12/2003)

NF EN 60749-25, C96-022-25 (12/2003)

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Semiconductor devices - Mechanical and climatic test methods - Part 25 : temperature cycling - Dispositifs de semiconducteurs

€52.00

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UNE-EN 60749-16:2003

UNE-EN 60749-16:2003

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Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)

€48.00

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