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DIN EN 62047-27:2015-08
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/216/CD:2015)
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Summary
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 27: Prüfung der Bondfestigkeit von Glasfritt gebondeten Strukturen unter Verwendung des Mikro-Chevron-Tests (MCT) (IEC 47F/216/CD:2015)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2015 |
| Cancellation Date | 09/01/2018 |
| Page Count | 26 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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