31.080.01 : Semiconductor devices in general

UNE-EN 60749-19:2003

UNE-EN 60749-19:2003

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Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

€36.00

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IEC 60191-2:1966/AMD9:2003

IEC 60191-2:1966/AMD9:2003

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Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

€22.00

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IEC 60191-6-10:2003

IEC 60191-6-10:2003

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Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

€88.00

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NF EN 60749-8, C96-022-8 (11/2003)

NF EN 60749-8, C96-022-8 (11/2003)

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Semiconductor devices - Mechanical and climatic test methods - Part 8 : sealing - Dispositifs à semiconducteurs

€95.67

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NF EN 60749-22, C96-022-22 (11/2003)

NF EN 60749-22, C96-022-22 (11/2003)

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Semiconductor devices - Mechanical and climatic test methods - Part 22 : bond strength - Dispositifs à semiconducteurs

€82.00

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NF EN 60749-31, C96-022-31 (11/2003)

NF EN 60749-31, C96-022-31 (11/2003)

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Semiconductor devices - Mechanical and climatic test methods - Part 31 : flammability of plastic-encapsulated devices (internally induced) - Dispositifs à semiconducteurs

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NF EN 60749-32, C96-022-32 (11/2003)

NF EN 60749-32, C96-022-32 (11/2003)

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Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced) - Dispositifs à semiconducteurs

€28.00

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NF EN 60749-1, C96-022-1 (11/2003)

NF EN 60749-1, C96-022-1 (11/2003)

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Semiconductor devices - Mechanical and climatic test methods - Part 1 : general - Dispositifs à semiconducteurs

€59.33

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NF EN 60191-6-4, C96-013-6-4 (11/2003)

NF EN 60191-6-4, C96-013-6-4 (11/2003)

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Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

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BS EN 60749-25:2003

BS EN 60749-25:2003

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Semiconductor devices. Mechanical and climatic test methods Temperature cycling

€193.00

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BS EN 60749-11:2002

BS EN 60749-11:2002

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Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method

€165.00

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UNE-EN 60191-6-2:2003

UNE-EN 60191-6-2:2003

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Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

€59.00

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DIN EN 60749-16:2003-09

DIN EN 60749-16:2003-09

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Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003

€56.17

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IEEE/ANSI N42.31:2003

IEEE/ANSI N42.31:2003

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American National Standard for Measurement Procedures for Resolution and Efficiency of Wide-Bandgap Semiconductor Detectors of Ionizing Radiation

€99.00

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IEC 60749-11:2002/COR2:2003

IEC 60749-11:2002/COR2:2003

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Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

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