Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020.
€98.32
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020
€111.40
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 47/2718/CDV:2021); German and English version prEN IEC 63287-2:2021
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020); German version EN IEC 60749-41:2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020.
€116.64
Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (IEC 63287-1:2021); German version EN IEC 63287-1:2021.
€145.14
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022); German version EN IEC 60749-10:2022
€84.58
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 47/2274/CD:2016)
Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices (IEC 47F/220/CD:2015)
€91.03
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015); German version EN 62047-15:2015
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
€157.10
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
€77.20
