Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003.
€91.03
Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life - Dispositifs à semiconducteurs
€37.50
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
€165.00
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased autoclave
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
€63.00
Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
€61.00
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
€51.00
Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
€65.00
International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
€137.00
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003.
€77.20
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages Dimensions P-VSON
€193.00
Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€44.00
