Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
€44.00
Semiconductor devices. Mechanical and climatic test methods Acceleration, steady state
€165.00
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
€88.00
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
€48.00
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
€41.00
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
€0.00
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002.
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002.
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide 1,50 mm, 1,27 mm and 1,00 pitch ball column terminal
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
€22.00
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
€11.00
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Semiconductor devices - Mechanical and climatic test methods - Part 2 : low air pressure - Dispositifs à semiconducteurs
€59.33
Semiconductor devices - Mechanical and climatic test methods - Part 11 : rapid change of temperature - Two-fluid-bath method - Dispositifs à semiconducteurs
