Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
€0.00
Semiconductor devices. Mechanical and climatic test methods Low air pressure
€165.00
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
€22.00
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
€88.00
Mechanical standardization of semiconductor devices - Part 6-5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
€70.33
Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lead terminals
€53.67
Mechanical standardization of semiconductor devices - Part 6-6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-8 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers plats quadrangulaires en céramique, scellement verre
€52.00
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-2 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers à broches en forme de billes et de colonnes, avec des pas de 1,50 mm, 1,27 mm et 1,00 mm
€77.67
Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
€51.00
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
€54.00
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
€59.00
Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
€176.00
