IEC 60191-6-2:2001/COR1:2002
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IEC 60191-6-2:2001/COR1:2002

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
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Publisher International Electrotechnical Commission (IEC)
Publication Date 10/18/2002
Release Date 10/18/2002
Edition 1
Page Count 0
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ISBN ---
Weight (in grams) ---

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