31.080.01 : Semiconductor devices in general

IEC 60191-6-8:2001

IEC 60191-6-8:2001

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Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

€44.00

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PD ES 59008-5-1:2001

PD ES 59008-5-1:2001

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Data requirements for semiconductor die. Particular and recommendations die types Bare

€165.00

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IEC 60191-2:1966/AMD2:2001

IEC 60191-2:1966/AMD2:2001

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Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

€22.00

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PD ES 59008-5-2:2001

PD ES 59008-5-2:2001

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Data requirements for semiconductor die. Particular and recommendations die types Bare with added connection structures

€165.00

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PD ES 59008-6-2:2001

PD ES 59008-6-2:2001

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Data requirements for semiconductor die. Exchange data formats and dictionary

€269.00

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BS IEC 60747-14-2:2000

BS IEC 60747-14-2:2000

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Discrete semiconductor devices and integrated circuits. Semiconductor devices. sensors Hall elements

€193.00

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BS EN 60191-6-3:2001

BS EN 60191-6-3:2001

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Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions quad flat packs (QFP)

€193.00

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NF EN 60191-6-3, C96-013-6-3 (04/2001)

NF EN 60191-6-3, C96-013-6-3 (04/2001)

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Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

€86.33

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IEC 60747-16-2:2001

IEC 60747-16-2:2001

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Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers

€231.00

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IEC 60191-6-6:2001

IEC 60191-6-6:2001

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Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

€88.00

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PD ES 59008-4-1:2001

PD ES 59008-4-1:2001

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Data requirements for semiconductor die. Specific and recommendations Test quality

€165.00

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IEC 60191-2:1966/AMD1:2001

IEC 60191-2:1966/AMD1:2001

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Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

€22.00

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UNE-EN 60191-3:2001

UNE-EN 60191-3:2001

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Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.

€110.00

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IEC 60191-2Z:2000

IEC 60191-2Z:2000

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Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

€22.00

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IEC 60191-6-3:2000

IEC 60191-6-3:2000

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Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

€127.00

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