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IEC 60191-6-8:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
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Summary
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/27/2001 |
| Release Date | 08/27/2001 |
| Edition | 1 |
| Page Count | 22 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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