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IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
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Summary
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 09/29/2000 |
| Release Date | 09/29/2000 |
| Edition | 1 |
| Page Count | 34 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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