Normalisation mécanique des dispositifs à semiconducteurs - Partie 3 : règles générales pour la préparation des dessins d'encombrement des circuits intégrés
€166.33
Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€176.00
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings integrated circuits
€374.00
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€0.00
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
€369.00
Mechanical standardization of semiconductor devices - Part 2: Dimensions
€88.00
Environmental testing. Test methods Body strength and impact shock
€193.00
Twenty-first supplement
Amendment 1 - VMEbus - Microprocessor system bus for 1 byte to 4 byte data
€44.00
Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval); German version EN 153000:1998
€98.32
Twentieth supplement
Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval)
€269.00
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) integrated circuits
€316.00
Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes (IEC 60617-5:1996); German version EN 60617-5:1996
€134.02
Nineteenth supplement
€22.00
