Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
€59.00
Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
€50.00
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
€53.00
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
€58.00
Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
€99.97
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength - Dispositifs à semiconducteurs
€43.67
Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life - Dispositifs à semiconducteurs
€28.00
Semiconductor devices - Mechanical and climatic test methods - Part 30 : preconditioning of non-hermetic surface mount devices prior to reliability testing - Dispositifs à semiconducteurs
€59.33
Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced) - Dispositifs à semiconducteurs
Semiconductor devices - Mechanical and climatic test methods - Part 40 : board level drop test method using a strain gauge - Dispositifs à semiconducteurs
€111.67
Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS - Dispositifs à semiconducteurs
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
€64.00
LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED MICROCIRCUITS.
€91.00
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022); German version EN IEC 60749-10:2022.
€91.03
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 47/2770/CDV:2022); German and English version prEN IEC 60749-5:2022
€69.91
