Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 47E/812/CDV:2023); German and English version prEN IEC 60747-15:2023
€167.66
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 47/2770/CDV:2022); German and English version prEN IEC 60749-5:2022
€69.91
Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of sound variation detection (IEC 47/2742/CDV:2021); German and English version prEN IEC 63364-1:2021
€84.58
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022); German version EN IEC 60749-10:2022
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020
€111.40
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 47/2718/CDV:2021); German and English version prEN IEC 63287-2:2021
€98.32
Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)
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Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for LSI reliability qualification (IEC 47/2614/CDV:2020); German and English version prEN IEC 63287-1:2020
€150.65
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2575/CDV:2019); German and English version prEN IEC 60749-15:2019
€63.27
Standard Practice for Characterizing Neutron Fluence Spectra in Terms of an Equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019
€122.34
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2562/CDV:2019); German version prEN IEC 60749-30:2019
€91.03
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 47/2468/CDV:2018); German and English version prEN 60749-18:2018
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017); German version EN 60749-43:2017.
€128.22
Standard Guide for Neutron Irradiation of Unbiased Electronic Components
