Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
€128.22
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
€316.00
Standard Practice for Characterizing Neutron Fluence Spectra in Terms of an Equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics
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Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014)
€105.42
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013)
€116.64
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 47F/177/CD:2013)
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plan (IEC 47/2169/CD:2013)
Amendment 1 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
€11.00
Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
€638.00
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
€325.00
Normalisation mécanique des dispositifs à semiconducteurs - Partie 1 : règles générales pour la préparation des dessins d'encombrement des dispositifs discrets
€138.00
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 47F/125/CD:2012)
€69.91
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 47F/128/CD:2012)
€63.27
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 47F/127/CD:2012)
€77.20
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass (IEC 47F/126/CD:2012)
