IEC 60191-2:1966/AMD18:2011 Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€133.00
IRE Standards on Solid-State Devices: Definitions of Semiconductor Terms
€14.00
IEEE Standard Letter Symbols for Semiconductor Devices
€51.00
IEEE Standard Definitions and Characterization of Metal Nitride Oxide Semiconductor Arrays
€107.00
IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
€23.00
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
€93.00
IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
€186.00
IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
IEC 60749-11:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
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IEC 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
€12.00
IEC 60749-8:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
€0.00
IEC 60191-2:1966/AMD8:2003 Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
€46.00
