31.080.01 : Semiconductor devices in general

BS EN 60749-30:2005+A1:2011

BS EN 60749-30:2005+A1:2011

Superseded Historical

Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing

€193.00

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DIN IEC 60749-26:2011-09

DIN IEC 60749-26:2011-09

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge sensitivity testing - Human body model (HBM) - Component Level (IEC 47/2101A/CDV:2011)

€122.34

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IEC 60749-30:2005+AMD1:2011 Consolidated

IEC 60749-30:2005+AMD1:2011 Consolidated

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

€187.00

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UNE-EN 60749-15:2011

UNE-EN 60749-15:2011

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

€51.00

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BS EN 60749-15:2010

BS EN 60749-15:2010

Superseded Historical

Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices

€165.00

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IEC 60749-7:2011

IEC 60749-7:2011

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

€44.00

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DIN EN 60749-15:2011-06

DIN EN 60749-15:2011-06

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010); German version EN 60749-15:2010 + AC:2011.

€63.27

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DIN EN 62047-17:2011-06

DIN EN 62047-17:2011-06

Superseded Historical

Semiconductor devices - Micro- electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin film (IEC 47F/78/CD:2011)

€111.40

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DIN EN 62047-18:2011-06

DIN EN 62047-18:2011-06

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 18: Bending test methods of thin film materials (IEC 47F/76/CD:2011)

€69.91

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IEC 60749-30:2005/AMD1:2011

IEC 60749-30:2005/AMD1:2011

Superseded Historical

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

€22.00

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IEC 60749-21:2011

IEC 60749-21:2011

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

€176.00

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NF EN 60749-15, C96-022-15 (04/2011)

NF EN 60749-15, C96-022-15 (04/2011)

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15 : resistance to soldering temperature for through-hole mounted devices - Dispositifs à semiconducteurs

€59.33

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IEC 60749-23:2004+AMD1:2011 Consolidated

IEC 60749-23:2004+AMD1:2011 Consolidated

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

€94.00

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IEC 60749-23:2004/AMD1:2011

IEC 60749-23:2004/AMD1:2011

Superseded Historical

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

€11.00

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ASTM F1893-11

ASTM F1893-11

Superseded Historical

Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices

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