Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
€22.00
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 47F/59/CD:2010)
€98.32
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)
€91.03
Semiconductor devices - Micro-electromechanical devices - Part 12: A method for fatigue testing thin film materials using the resonant vibration of a MEMS structure (IEC 47F/43/CD:2010)
€111.40
Semiconductor devices - Micro-electromechanical devices - Part 10: Micropillar compression test for MEMS materials (IEC 47F/48/CD:2010)
€69.91
Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009.
Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Dispositifs à semiconducteurs
€111.67
Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect moisture soldering heat
€269.00
Fixed resistors for use in electronic equipment - Part 2: Sectional specification - Fixed low-power non-wirewound resistors (IEC 40/2013/CD:2009)
€140.00
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 47/2026/CDV:2009); German version FprEN 60749-29:2009
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2019/CDV:2009); German version EN 60749-30:2005/FprA1:2009
€48.79
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2021/CDV:2009); German version FprEN 60749-7:2009
Semiconductor die products - Part 2: Exchange data formats (IEC 47/2023/CDV:2009); English version FprEN 62258-2:2009
€185.05
