Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
€105.42
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 47/2027/CDV:2009); German version FprEN 60749-34:2009
€63.27
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 47/2018/CDV:2009); German version EN 60749-32:2003/FprA1:2009
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/2017/CDV:2009); German version EN 60749-23:2004/FprA1:2009
Semiconductor devices - Part 1: General (IEC 47/2015A/CDV:2009)
€56.17
Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
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Standard Practice for Characterizing Neutron Fluence Spectra in Terms of an Equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 47/2012/CD:2009)
€111.40
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
Dispositifs optoélectroniques à semiconducteurs pour application dans les systèmes à fibres optiques - Partie 1 : modèle de spécification relatif aux valeurs et caractéristiques essentielles
€138.00
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
€286.00
Electrostatic Discharge Sensitivity Testing - Transmission Line Pulse (TLP) - Component Level (IEC 47/2006/CDV:2008)
Semiconductor optoelectronic devices for fibre optic system applications Specification template essential ratings and characteristics
€316.00
