Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) test (IEC 47/1584/CDV:2001); German version prEN 60749-16:2001
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 47/1588/CDV:2001); German version prEN 60749-17:2001
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionising Radiation (total dose); Test procedure (IEC 47/1589/CDV:2001); German version prEN 60749-18:2001
€69.91
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test (IEC 47/1590/CDV:2001); German version prEN 60749-19:2001
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration steady state (IEC 47/1585/CDV:2001); German version prEN 60749-36:2001
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
€98.32
Constant Current Electromigration Test (IEC 47/1954/CD:2008)
€84.58
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 47/1961/CD:2008)
Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2005); German version EN 62258-2:2005, text in English.
€157.10
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method of components for handheld electronic products (IEC 47/1824/CD:2005)
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001.
€162.06
IEC 60749-34-1:2025 Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
€244.00
Microstructures - Microélectronique hyperfréquence - Microélectronique hyperfréquence et dispositifs relevant des mêmes prescriptions - Atténuateurs et charges.
€145.67
Normalisation thermique des boîtiers de semiconducteurs - Partie 6-1: Modèle de résistance thermique et de capacité pour la prédiction de la température transitoire aux points de jonction et de mesure - Méthode de création de modèle utilisant une fiche te
€61.00
IEC 60749-22-1:2025 Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
€441.00
