31.080.01 : Semiconductor devices in general

IEC PAS 60191-6-18:2008

IEC PAS 60191-6-18:2008

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

€127.00

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IEC PAS 60191-6-19:2008

IEC PAS 60191-6-19:2008

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

€176.00

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BS IEC 60747-9:2007

BS IEC 60747-9:2007

Superseded Historical

Semiconductor devices. Discrete devices Insulated-gate bipolar transistors (IGBTs)

€374.00

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DIN EN 60749-20:2007-10

DIN EN 60749-20:2007-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007

€105.42

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IEC 60747-5-5:2007

IEC 60747-5-5:2007

Superseded Historical

Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers

€369.00

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IEC 60747-9:2007

IEC 60747-9:2007

Superseded Historical

Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs)

€369.00

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DIN IEC 62047-6:2007-07

DIN IEC 62047-6:2007-07

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 47/1900/CD:2007)

€91.03

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BS IEC 60191-1:2007

BS IEC 60191-1:2007

Superseded Historical

Mechanical standardization of semiconductor devices General rules for the preparation outline drawings discrete

€316.00

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IEC 60191-6-13:2007

IEC 60191-6-13:2007

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

€88.00

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DIN IEC 60747-15:2007-06

DIN IEC 60747-15:2007-06

Superseded Historical

Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)

€122.34

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IEC 60191-1:2007

IEC 60191-1:2007

Superseded Historical

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

€286.00

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DD IEC/PAS 62483:2006

DD IEC/PAS 62483:2006

Superseded Historical

Test method for measuring whisker growth on tin and tin alloy surface finishes

€269.00

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DIN EN 60749-27:2007-01

DIN EN 60749-27:2007-01

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006); German version EN 60749-27:2006.

€77.20

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BS EN 60749-39:2006

BS EN 60749-39:2006

Superseded Historical

Semiconductor devices. Mechanical and climatic test methods Measurement of moisture diffusivity water solubility in organic materials used for semiconductor components

€165.00

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NF EN 60749-39, C96-022-39 (12/2006)

NF EN 60749-39, C96-022-39 (12/2006)

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components - Dispositifs à semiconducteurs

€59.33

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