Superseded
Standard
Historical
IEC 60191-6-13:2007
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
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Summary
IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 06/27/2007 |
| Release Date | 06/27/2007 |
| Cancellation Date | 09/27/2016 |
| Edition | 1 |
| Page Count | 29 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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