Superseded
Standard
Historical
IEC PAS 60191-6-18:2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
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Summary
This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/22/2008 |
| Release Date | 01/22/2008 |
| Cancellation Date | 01/07/2010 |
| Edition | 1 |
| Page Count | 19 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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