IEC 60191-6-18:2010/COR1:2010
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IEC 60191-6-18:2010/COR1:2010

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
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Publisher International Electrotechnical Commission (IEC)
Publication Date 05/31/2010
Release Date 05/31/2010
Edition 1
Page Count 0
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