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IEC 60191-6-18:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
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Summary
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.
The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.
The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/07/2010 |
| Release Date | 01/07/2010 |
| Edition | 1 |
| Page Count | 40 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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