Microstructures - Microélectronique hyperfréquence - Coupleurs - Prescriptions générales
€143.00
Dispositifs optoélectroniques à semiconducteurs pour application dans les systèmes à fibres optiques - Partie 1 : modèle de spécification relatif aux valeurs et caractéristiques essentielles
€131.33
Composants électroniques - Système CENELEC d'assurance de la qualité - Dispositifs discrets à semiconducteurs - Spécification générique.
€184.00
Microstructures - Microélectronique hyperfréquence - Coupleurs - Recueil de spécifications particulières.
€95.67
Composants électroniques - Système CENELEC d'assurance de la qualité - Dispositifs discrets à semiconducteurs - Spécification générique
€198.33
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module (IEC 47/2759/CD:2022); Text in German and English
€105.42
IEC 60796-1:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 1: Functional description with electrical and timing specifications
€389.00
IEC 60796-2:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 2: Mechanical and pin descriptions for the system BUS configuration, with edge connectors (direct)
€46.00
IEC 60796-3:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 3: Mechanical and pin descriptions for the Eurocard configuration with pin and socket (indirect) connectors
IEC 60191-2T:1996 Eighteenth supplement
€12.00
IEC 60191-5:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
€302.00
IEC 60191-2V:1998 Twentieth supplement
IEC 60191-2W:1999 Twenty-first supplement
€93.00
IEC 60191-2X:1999 Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
