Semiconductor die products - Part 2: Exchange data formats (IEC 47/2023/CDV:2009); English version FprEN 62258-2:2009
€185.05
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
€105.42
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 47/2027/CDV:2009); German version FprEN 60749-34:2009
€63.27
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 47/2026/CDV:2009); German version FprEN 60749-29:2009
€111.40
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS Switches (IEC 47/1928/CD:2007)
€116.64
Time Dependent Dielectric Breakdown Test (TDDB) for Inter-metal layers (IEC 47/1946/CD:2007)
€91.03
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 47F/59/CD:2010)
€98.32
Semiconductor devices - Micro-electromechanical devices - Part 12: A method for fatigue testing thin film materials using the resonant vibration of a MEMS structure (IEC 47F/43/CD:2010)
Semiconductor devices - Micro-electromechanical devices - Part 10: Micropillar compression test for MEMS materials (IEC 47F/48/CD:2010)
€69.91
Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/1682/CD:2003)
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003); German version EN 60749-19:2003 + Corrigendum 2003-06.
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2003); German version EN 60749-15:2003.
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003.
