Composants électroniques - Dispositifs à semiconducteurs - Essais mécaniques et climatiques
€101.00
Dispositifs hyperfréquences - Relais et commutateurs électromécaniques coaxiaux et en guides d'ondes - Recueil de spécifications particulières
€43.67
Dispositifs hyperfréquences - Lignes à retard actives - Éléments entrant dans la définition des procédés technologiques pour l'agrément de savoir-faire et recueil de spécifications particulières
€95.67
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 47/1857/CD:2006)
€111.40
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)
€122.34
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 47/1900/CD:2007)
€91.03
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023); German version EN IEC 63287-2:2023.
€98.32
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 47/2012/CD:2009)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
€63.27
Semiconductor devices - Part 1: General (IEC 47/2015A/CDV:2009)
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 47/2018/CDV:2009); German version EN 60749-32:2003/FprA1:2009
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/2017/CDV:2009); German version EN 60749-23:2004/FprA1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2019/CDV:2009); German version EN 60749-30:2005/FprA1:2009
€48.79
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2021/CDV:2009); German version FprEN 60749-7:2009
€69.91
