Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/607A/CD:2005)
€122.34
Semiconductor devices - Part 1: General (IEC 47/1734/CD:2003)
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 60749-29:2003); German version EN 60749-29:2003 + Corrigendum:2004.
€98.32
Microelectromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 47/1759/CD:2004)
€69.91
Microelectromechanical devices - Part 3: Thin film standard test piece (IEC 47/1760/CD:2004)
€41.78
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 26 : essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain (HBM)
€158.33
Semiconductor devices - Requirements for resistance to dissolution of metallization on surface mounting (SMD) (IEC 47/1390/CD:1995)
€48.79
Pin 1 mark for identification in automatic handling systems (IEC 47D/53/CD:1994)
Semiconductor devices; amendments of the rules for subscripts and indication of polarity (IEC 47(Central Office)1336:1992)
€34.30
Semiconductor devices - Visual inspection of discrete semiconductor devices (IEC 47E(Secretariat)6:1994)
€214.30
Semiconductor devices; protections of electrostatic-sensitive devices (IEC 47(Secretariat)1330:1993)
€105.42
Electrostatic Discharge Sensitivity Testing - Transmission Line Pulse (TLP) - Component Level (IEC 47/2006/CDV:2008)
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996); German version EN 60749:1999.
€116.64
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power Cycling (IEC 47/1648/CD:2002)
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2002); German version EN 60749-7:2002.
€56.17
