Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance; Unbiased HAST (IEC 47/1646/CD:2002)
€48.79
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-12 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers FLGA de type rectangulaire
€86.33
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
€237.00
€30.00
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/1636/CD:2002)
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance; Unbiased autoclave (IEC 47/1637/CD:2002)
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
€176.00
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
€165.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitch land grid array (FLGA). Rectangular type
€269.00
Semiconductor devices. Mechanical and climatic test methods
€404.00
Semiconductor devices. Mechanical and climatic test methods shock
Semiconductor devices. Mechanical and climatic test methods Salt atmosphere
Semiconductor devices. Mechanical and climatic test methods Internal moisture content measurement the analysis of other residual gases
Semiconductor devices. Mechanical and climatic test methods External visual examination
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
