31.080.01 : Semiconductor devices in general

DIN IEC 60749-28:2003-02

DIN IEC 60749-28:2003-02

Withdrawn Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing; Charged device model (CDM) (IEC 47/1658/CD:2002)

€63.27

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DIN EN 60749-34:2004-10

DIN EN 60749-34:2004-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2004); German version EN 60749-34:2004.

€69.91

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DIN IEC 62374:2004-09

DIN IEC 62374:2004-09

Superseded Historical

Time Dependent Dielectric Breakdown Test (TDDB) (IEC 47/1764/CD:2004)

€91.03

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UTE C96-027, C96-027U (06/1997)

UTE C96-027, C96-027U (06/1997)

Superseded Historical

Dispositifs à semiconducteurs - Règles pour la gestion de la fin de vie des composants et pour leur remplacement (obsolescence des composants électroniques) - Prescriptions provisoires.

€30.50

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UTE C96-027, C96-027U (03/1998)

UTE C96-027, C96-027U (03/1998)

Superseded Historical

Dispositifs à semiconducteurs - Règles pour la gestion de la fin de vie des composants et pour leur remplacement (obsolescence des composants électroniques). Prescriptions provisoires.

€34.00

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IEC 60191-2:2025 DB

IEC 60191-2:2025 DB

Active Most Recent

IEC 60191-2:2025 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions

€441.00

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IEC 60749-27:2006/AMD1:2012

IEC 60749-27:2006/AMD1:2012

Active Most Recent

IEC 60749-27:2006/AMD1:2012 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

€12.00

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IEC 60191-2:1966/AMD19:2012

IEC 60191-2:1966/AMD19:2012

Active Most Recent

IEC 60191-2:1966/AMD19:2012 Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

€186.00

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IEC 60191-6-22:2012

IEC 60191-6-22:2012

Active Most Recent

IEC 60191-6-22:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

€133.00

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IEC 60749-26:2013

IEC 60749-26:2013

Superseded Historical

IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

€342.00

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IEC 60747-5-5:2007/AMD1:2013

IEC 60747-5-5:2007/AMD1:2013

Superseded Historical

IEC 60747-5-5:2007/AMD1:2013 Amendment 1 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers

€12.00

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IEC 62483:2013

IEC 62483:2013

Active Most Recent

IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

€342.00

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IEC 60191-4:2013

IEC 60191-4:2013

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IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

€186.00

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IEC 60749-42:2014

IEC 60749-42:2014

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IEC 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

€23.00

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IEC 62007-1:2015

IEC 62007-1:2015

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IEC 62007-1:2015 Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics

€302.00

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