Superseded
Draft amendment
Historical
DIN EN 60749-19/A1:2009-10
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009
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Summary
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit (IEC 47/2016/CDV:2009); Deutsche Fassung EN 60749-19:2003/FprA1:2009
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 10/01/2009 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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