Superseded
Standard
Historical
IEC PAS 60191-6-19:2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
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Summary
This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/22/2008 |
| Release Date | 01/22/2008 |
| Cancellation Date | 02/25/2010 |
| Edition | 1 |
| Page Count | 22 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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