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IEC 60191-6-10:2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
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Summary
IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/19/2003 |
| Release Date | 11/19/2003 |
| Edition | 1 |
| Page Count | 24 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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