Design and use of printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations; section 2: Discrete components (IEC 52/573/CD:1995)
€145.14
Design and use of printed boards and printed boards assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations; section 7: Components with Post (DIP) mounting leads on two sides (IEC 52/578/CD:1995)
€56.17
Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; Section 3: Components with Gull-wing leads on two sides (IEC 52/574/CD:1995)
€98.32
Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 4: Components with J leads on two sides (IEC 52/575/CD:1995)
€63.27
Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 5: Components with Gull-wing leads on four sides (IEC 52/576/CD:1995)
€105.42
Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 6: Components with J leads on four sides (IEC 52/577/CD:1995)
€84.58
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error rate testing of electronic components (IEC 47/1796/CD:2004)
Ensembles de cartes imprimées - Partie 2 : spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface
€109.00
Modular order for the development of mechanical structures for electronic equipment practice (IEC 48D/104/CD:1996)
€77.20
Amendment 1 to IEC 61189-1: Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 52/643/CD:1996)
€48.79
Amendment 3 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 52/644/CD:1996)
€41.78
Amendment 3 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 52/645/CD:1996)
€69.91
Draft IEC 61191-1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 91/96/CDV:1996)
€111.40
Draft IEC 61191-2: Sectional specification - Requirements for surface mount solder assembly (IEC 91/97/CDV:1996)
€91.03
Draft IEC 61191-3: Sectional specification - Requirements for through-hole solder assembly (IEC 91/98/CDV:1996)
