Printed board assemblies Sectional specification. Requirements for surface mount soldered
€269.00
Mapping rules and exchange methods for heterogeneous parts libraries (IEC 91/1078/CDV:2013); German version FprEN 62699:2013
€122.34
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
€374.00
Environmental testing - Part 2-21 : tests - Test U : robustness of terminations and integral mounting devices
€150.67
Environmental testing - Part 2-69 : tests - Test Te : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
€111.67
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
€231.00
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€325.00
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 91/1056/CD:2012)
€140.00
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011.
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)
€84.58
Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
€0.00
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
€316.00
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
€286.00
Conduit systems for cable management Particular requirements. Flexible conduit
€193.00
