Modular order for the development of mechanical structures for electronic equipment practices (IEC 60917:1988/A1:1993); German version EN 60917:1990/A1:1994
€34.30
Technical Report; application of IEC 60617-12 and 60617-13; identical with IEC 3A(Secretariat)341:1993
€56.17
Generic specification: modular electronic units; German version EN 160000:1993
Product performance requirements - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 91/326/CD:2002)
€116.64
IEC 61188-2: Design and use of printed boards and printed board assemblies - Part 2: Guide to the use of printed wiring board substrate materials; surface mount technology (IEC 52/686/CDV:1996)
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002.
€91.03
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002); German version EN 61190-1-3:2002.
IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
€441.00
IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
€133.00
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
€186.00
IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
€342.00
IEC 60068-2-58:2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
€302.00
IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
€244.00
