Exigences relatives à la qualité d'exécution des assemblages électroniques brasés - Partie 5 : retouche, modification et réparation des assemblages électroniques brasés
€153.00
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007); German version EN 61192-5:2007
€122.34
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
€78.00
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007.
€98.32
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007.
€116.64
Printed board and printed board assemblies - Design and use - Part 7: Sectional requirements - Electronic component zero orientation for CAD library construction (IEC 91/701/CDV:2007); German version prEN 61188-7:2007
€91.03
Workmanship requirements for soldered electric assemblies Rework, modification and repair of electronic
€316.00
Environmental testing Tests. Test Te. Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method
€269.00
Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components
Attachment materials for electronic assembly Requirements soldering pastes high-quality interconnects in electronics
€193.00
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
€286.00
€176.00
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
€127.00
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Conception, fabrication et assemblage des cartes imprimées - Termes et définitions
€214.67
