31.190 : Electronic component assemblies

BS EN 61340-3-1:2002

BS EN 61340-3-1:2002

Superseded Historical

Electrostatics. Methods for simulation of electrostatic effects Human body model (HBM). Component testing

€165.00

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NF EN 60352-2/A2, C93-023/A2 (06/2002)

NF EN 60352-2/A2, C93-023/A2 (06/2002)

Superseded Historical

Connexions sans soudure - Partie 2 : connexions serties sans soudure - Règles générales, méthodes d'essai et guide pratique

€59.33

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IEC 61190-1-2:2002

IEC 61190-1-2:2002

Superseded Historical

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

€127.00

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IEC 61190-1-3:2002

IEC 61190-1-3:2002

Superseded Historical

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

€286.00

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BS EN 61189-2:1997

BS EN 61189-2:1997

Superseded Historical

Test methods for electrical materials, printed boards and other interconnection structures assemblies materials

€404.00

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BS EN 61189-3:1997

BS EN 61189-3:1997

Superseded Historical

Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards)

€374.00

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IEC 60194:1999

IEC 60194:1999

Superseded Historical

Printed board design, manufacture and assembly - Terms and definitions

€446.00

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DIN IEC 91/151/CD:1999-03

DIN IEC 91/151/CD:1999-03

Superseded Historical

IEC 61192-1: Printed board assemblies - Part 1: Generic specification: Workmanship requirements and guidelines for soldered electronic assemblies (IEC 91/151/CD:1998)

€128.22

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IEC 60068-2-58:1999

IEC 60068-2-58:1999

Superseded Historical

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

€127.00

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IEC 60068-2-77:1999

IEC 60068-2-77:1999

Superseded Historical

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

€44.00

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IEC 60068-2-21:1999

IEC 60068-2-21:1999

Superseded Historical

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

€231.00

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DIN IEC 47/1425/CD:1998-11

DIN IEC 47/1425/CD:1998-11

Superseded Historical

Amendment to IEC 60749 "Update of Chapter 2 subclause 2.3: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat" and of Chapter 3 clause 5: "Sealing"

€122.34

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BS EN 160200-1:1998

BS EN 160200-1:1998

Withdrawn Most Recent

Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular units assessed Capability approval procedure

€316.00

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BS EN 160201:1998

BS EN 160201:1998

Withdrawn Most Recent

Harmonized system of quality assessment for electronic components. Blank detail specification. Microwave modular electronic units of assessed quality. Capability approval

€165.00

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UTE C90-702 (03/1998)

UTE C90-702 (03/1998)

Superseded Historical

Technique de montage en surface - Spécification générique. Procédures d'agrément de savoir-faire (ASF) pour processus d'assemblage en surface.

€114.00

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