31.190 : Electronic component assemblies

IEC 62137-1-1:2007

IEC 62137-1-1:2007

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IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

€93.00

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IEC 62137-1-2:2007

IEC 62137-1-2:2007

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IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

€133.00

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IEC 62421:2007

IEC 62421:2007

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IEC 62421:2007 Electronics assembly technology - Electronic modules

€93.00

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IEC 61193-2:2007

IEC 61193-2:2007

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IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

€133.00

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NF EN 60068-2-83, C20-783 (01/2012)

NF EN 60068-2-83, C20-783 (01/2012)

Superseded Historical

Environmental testing - Part 2-83 : tests - Test Tf : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

€126.00

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UTE C90-702 (03/1998)

UTE C90-702 (03/1998)

Superseded Historical

Technique de montage en surface - Spécification générique. Procédures d'agrément de savoir-faire (ASF) pour processus d'assemblage en surface.

€114.00

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NF EN 62137, C93-704 (06/2005)

NF EN 62137, C93-704 (06/2005)

Superseded Historical

Essais d'environnement et d'endurance - Méthodes d'essais pour les cartes à montage en surface de boîtiers de type matriciel FBGA, BGA, FLGA, LGA, SON, et QFN

€111.67

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NF EN 61760-4/A1, C90-710-4/A1 (05/2018)

NF EN 61760-4/A1, C90-710-4/A1 (05/2018)

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Surface mounting technology - Part 4 : classification, packaging, labelling and handling of moisture sensitive devices

€28.00

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