Superseded
Standard
Historical
IEC 61190-1-2:2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
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Summary
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/22/2002 |
| Release Date | 03/22/2002 |
| Cancellation Date | 04/26/2007 |
| Edition | 1 |
| Page Count | 35 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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