Superseded
Standard
Historical
IEC 61190-1-2:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Preview
Summary
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/26/2007 |
| Release Date | 04/26/2007 |
| Cancellation Date | 02/19/2014 |
| Edition | 2 |
| Page Count | 37 |
| Themes | Quality assurance |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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