Superseded
Standard
Historical
IEC 60068-2-58:1999
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Preview
Summary
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices.
The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/15/1999 |
| Release Date | 01/15/1999 |
| Cancellation Date | 07/15/2004 |
| Edition | 2 |
| Page Count | 17 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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