Superseded
Standard
Historical
IEC 60068-2-58:1989
Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
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Summary
Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/15/1989 |
| Release Date | 08/15/1989 |
| Cancellation Date | 01/15/1999 |
| Edition | 1 |
| Page Count | 25 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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