Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
€231.00
Printed board design, manufacture and assembly - Terms and definitions
€446.00
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
€79.00
Electronic Modules - Generic standard (IEC 91/546/CD:2005)
€77.20
High-voltage switchgear and controlgear AC metal-enclosed for rated voltages above 1 kV up to including 52
€404.00
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solder for electronic soldering applications (IEC 91/521/CD:2005)
€116.64
Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005)
€91.03
Essais d'environnement et d'endurance - Méthodes d'essais pour les cartes à montage en surface de boîtiers de type matriciel FBGA, BGA, FLGA, LGA, SON, et QFN
€111.67
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
€269.00
Environmental testing Tests. Test Td. methods for solderability, resistance to dissolution of metallization and soldering heat surface mounting devices (SMD)
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error rate testing of electronic components (IEC 47/1796/CD:2004)
€63.27
Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
€0.00
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-1 : considérations sur les liaisons pistes-soudures - Prescriptions génériques
€184.00
