DIN IEC 61190-1-2:2005-09
Superseded Draft standard
Historical

DIN IEC 61190-1-2:2005-09

Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005)

Summary

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage (IEC 91/520/CD:2005)

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 09/01/2005
Page Count 8
EAN ---
ISBN ---
Weight (in grams) ---
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