Superseded
Standard
Historical
IEC 62137:2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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Summary
This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.
This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.
This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 07/06/2004 |
| Release Date | 07/06/2004 |
| Cancellation Date | 10/09/2014 |
| Edition | 1 |
| Page Count | 57 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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