Draft BS EN 62878-2-604 Ed.1.0 Device embedding assembly technology Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer
€23.00
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025); German version EN IEC 62878-2-603:2025
€91.03
Draft BS IEC 62271-202/AMD1 ED3 Amendment 1 - High-voltage switchgear and controlgear
BS EN IEC 63609-3 Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements Part 3: Determination for temperature measurement in using thermocouples
Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies Part 1: requirements the circuit boards or with miniaturized SMDs where heat dissipation path to board is dominant
Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: conductivity of circuit boards with polymer composites
Technique du montage en surface – Partie 1 : Méthode normalisée pour la spécification des composants pour montage en surface (CMS)
€105.50
Technique du montage en surface - Partie 4 : Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l'humidité
€116.50
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
€316.00
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad
Essais d'environnement - Partie 2-83 : Essais - Essai Tf : Essai de brasabilité des composants électroniques pour les composants montés en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser
€138.00
IEC 60068-2-88:2025 Environmental testing - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid cleaning media
€296.00
IEC 60068-2-83:2025 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
