31.190 : Electronic component assemblies

IEC 60068-2-83:2025

IEC 60068-2-83:2025

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Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

€486.00

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BS EN IEC 62878-2-603:2025

BS EN IEC 62878-2-603:2025

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Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity

€193.00

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NF EN IEC 62878-2-603, C93-778-2-603 (04/2025)

NF EN IEC 62878-2-603, C93-778-2-603 (04/2025)

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Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-603 : lignes directrices pour un empilement de modules électroniques - Méthode d'essai de la connectivité électrique entre modules

€86.50

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DIN EN IEC 63215-2:2025-03

DIN EN IEC 63215-2:2025-03

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Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (IEC 63215-2:2023); German version EN IEC 63215-2:2023

€111.40

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IEC 62878-2-603:2025

IEC 62878-2-603:2025

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Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

€88.00

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IEC 60194-2:2025

IEC 60194-2:2025

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Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies

€325.00

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BS EN IEC 61188-6-3:2025

BS EN IEC 61188-6-3:2025

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Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)

€316.00

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IEC 61188-6-3:2024

IEC 61188-6-3:2024

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Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

€286.00

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24/30502381 DC:2024

24/30502381 DC:2024

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BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2

€23.00

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24/30498340 DC:2024

24/30498340 DC:2024

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BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage

€23.00

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PD IEC TR 60068-3-15:2024

PD IEC TR 60068-3-15:2024

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Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering

€269.00

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PD IEC TR 61760-5-1:2024

PD IEC TR 61760-5-1:2024

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Surface mounting technology strain on circuit board. Strain gauge measurement applied to chip components

€269.00

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PD IEC TS 62878-2-10:2024

PD IEC TS 62878-2-10:2024

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Device embedding assembly technology Part 2-10: Design specification for cavity substrate

€165.00

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IEC TR 60068-3-15:2024

IEC TR 60068-3-15:2024

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Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering

€231.00

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IEC TS 62878-2-10:2024

IEC TS 62878-2-10:2024

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Device embedding assembly technology - Part 2-10: Design specification for cavity substrate

€44.00

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