Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
€355.00
Product package labels for electronic components using bar code and two- dimensional symbologies
€316.00
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance test methods
Environmental testing Tests. Test Td: methods for solderability, resistance to dissolution of metallization and soldering heat surface mounting devices (SMD)
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
€374.00
Printed boards and printed board assemblies. Design use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint land design
Device embedding assembly technology Generic specification for device embedded substrates
€269.00
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test metal materials with surface processing
€193.00
Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on
Environmental testing Tests. Test Te/Tc. Solderability of electronic components and printed boards by the wetting balance (force measurement) method
Quality assessment systems Selection and use of sampling plans for printed board laminate end-product in-process auditing
Surface mounting technology Standard method for the specification of components through hole reflow (THR) soldering
