Printed boards and printed board assemblies - Design and use - Part 6-2 : land pattern design - Description of land pattern for the most common surface mounted components (SMD) - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-2 : conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants
€111.67
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
€286.00
Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
€523.00
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
€176.00
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
€231.00
Circuit boards and circuit board assemblies. Design use 3D shape data for CAD component library
€193.00
Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
€127.00
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
€156.00
Surface mounting technology - Part 1 : standard method for the specification of surface mounting components (SMDs)
€117.00
BS EN IEC 63215-2. Endurance test methods for die attach materials applied to power electronics devices Part 2. Temperature cycling method and reliability performance index Die discrete type electronic
€23.00
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
€316.00
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019
€140.00
Printed board assemblies Technical cleanliness of components and printed
€404.00
IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
€446.00
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019
€0.00
