Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
€374.00
Printed board assemblies Sectional specification. Requirements for surface mount soldered
€269.00
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
€355.00
Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid solders soldering applications
€316.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials
€404.00
Workmanship requirements for soldered electronic assemblies Surface-mount
Workmanship requirements for soldered electronic assemblies General
High-voltage switchgear and controlgear AC metal-enclosed for rated voltages above 1 kV up to including 52
Workmanship requirements for soldered electric assemblies Rework, modification and repair of electronic
Product package labels for electronic components using bar code and two-dimensional symbologies
Environmental testing Tests. Test Td. methods for solderability, resistance to dissolution of metallization and soldering heat surface mounting devices (SMD)
Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components
Attachment materials for electronic assembly Requirements soldering pastes high-quality interconnects in electronics
€193.00
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Environmental testing Tests. Test Te. Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method
