Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
€325.00
Product package labels for electronic components using bar code and two- dimensional symbologies (IEC 62090:2017); German version EN 62090:2017.
€122.34
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017.
€105.42
Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method - Essais d'environnement : Partie 2-69 : Essais - Essai Te : Essai de brasabilité des composants et cartes électroniques par la méthode de la balance de mouillage (mesure de la force)
€166.33
Product package labels for electronic components using bar code and two- dimensional symbologies
€316.00
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
€528.00
Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
€22.00
Product package labels for electronic components using bar code and two-dimensional symbologies
€126.00
Printed boards and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
€111.67
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
€286.00
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance test methods
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016
€98.32
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
€369.00
Méthode d'essai de l'érosion de l'équipement de brasage à la vague utilisant un alliage à braser sans plomb fondu - Partie 3 : document d'orientation pour le choix des méthodes d'essai d'érosion
