Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
€99.50
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
€84.58
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 : cyclic bending test - Technologie de montage en surface
€95.67
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5 : mechanical shear fatigue test - Technologie du montage en surface
€111.67
Surface mounting technology - Part 3 : standard method for the specification of components for Through Hole Reflow (THR) soldering
€120.00
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3 : cyclic drop test - Technique de montage en surface
Printed boards and printed board assemblies - Design and use - Part 5-2 : attachment (land/joint) considerations - Discrete components - Cartes imprimées et cartes imprimées équipées
€153.00
Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides
€126.00
Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides - Cartes imprimées et cartes imprimées équipées
Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides - Cartes imprimées et cartes imprimées équipées
Environmental testing - Part 2-69 : tests - Test Te : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1 : pull strength test - Technique du montage en surface
Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2 : shear strength test - Technique du montage en surface
Achievement of industrial process measurement and control equipment for electrical production and distribution installations. Electronic components and electronic modules. - Réalisation des équipements de mesure et de commande des processus industriels des installations de production et de distribution électrique
€93.67
Environmental testing - Part 2-21 : tests - Test U : robustness of terminations and integral mounting devices
€150.67
