Electronic components general. Guide for application of the french document C 90-551. Alloys, fluxes and creams for soft soldering test methods.
€166.50
Electronic assembly technology - Manufacturing line certification for electronic boards (QML) - Part 1 : guide for design and manufacturing of electronic assemblies - Technologies d'assemblage en électronique
€153.00
Electronic assembly technology - Manufacturing line certification for electronic boards (QML) - Part 2 : guide for obtaining QML agreement for electronic boards - Technologies d'assemblage en électronique
€166.33
Electronic components. General. Alloys, fluxes and solder creams for soft soldering. Definition of products.
€101.00
Printed board assemblies - Part 1 : generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€136.68
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007.
€98.32
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007); German version EN 61192-5:2007
€122.34
Electronics assembly technology - Electronic modules (IEC 62421:2007); German version EN 62421:2007
Workmanship requirements for soldered electric assemblies - Part 3: Through-hole mount assemblies (IEC 61192-3:2002); German version EN 61192-3:2003
€128.22
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies (IEC 61192-4:2002); German version EN 61192-4:2003
€105.42
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies (IEC 61192-2:2003); German version EN 61192-2:2003
€150.65
Workmanship requirements for soldered electronic assemblies - Part 1: General (IEC 61192-1:2003); German version EN 61192-1:2003
€162.06
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994
€69.91
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
Assurance produit des projets spatiaux - Soudure haute fiabilité pour les connexions électriques à montage en surface, à technologie combinée et montées à la main
€241.50
