Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
€286.00
Méthode d'essai de l'érosion de l'équipement de brasage à la vague utilisant un alliage à braser sans plomb fondu - Partie 2 : méthode d'essai d'érosion de matériaux métalliques avec traitement de surface
€95.67
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test metal materials with surface processing
€193.00
Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides
€93.67
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
€88.00
Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides - Cartes imprimées et cartes imprimées équipées
€65.33
Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides - Cartes imprimées et cartes imprimées équipées
€117.00
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-8 : considérations sur les liaisons pistes-soudures - Composants matriciels (BGA, FBGA, CGA, LGA)
€107.33
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
€111.40
Device embedded substrate Guidelines. Electrical testing
Device embedded substrate - Part 2-2: Guidelines - Electrical testing
Device embedded substrate - Part 1-1 : generic specification - Test methods - Substrat intégré à l'appareil
€166.33
Surface mounting technology - Part 4 : classification, packaging, labelling and handling of moisture sensitive devices
Device embedded substrate Generic specification. Test methods
€374.00
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015.
€140.00
