Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies
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Device embedding assembly technology Generic specification for device embedded substrates
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Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
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Device embedding assembly technology - Part 2-5 : guidelines - Implementation of a 3D data format for device embedded substrate - Substrat avec appareil(s) intégré(s) - Partie 2-5 : Mise en oeuvre d'un format de données 3D pour un substrat avec appareil(s) intégré(s)
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Printed board assemblies Sectional specification. Requirements for surface mount soldered
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Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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Environmental testing Tests. Test Te/Tc. Solderability of electronic components and printed boards by the wetting balance (force measurement) method
Conception, fabrication et assemblage de cartes imprimées - Vocabulaire - Partie 1 : Usage commun des techniques d'assemblage des composants électroniques et des cartes imprimées
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Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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Printed boards and printed board assemblies. Design use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint land design
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Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Printed boards and printed board assemblies - Design and use - Part 6-4 : land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design - Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4 : Exigences génériques pour les dessins dimensionnels de CMS du point de vue de la conception de la zone de report
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