Workmanship requirements for soldered electronic assemblies Through-hole mount
€355.00
Workmanship requirements for soldered electronic assemblies Terminal
€316.00
Attachment materials for electronic assembly Requirements solder pastes high-quality interconnections in
€193.00
Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid solders soldering applications
Electrostatics. Methods for simulation of electrostatic effects Human body model (HBM). Component testing
€165.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards)
€374.00
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Specification for capability approval of modular electronic networks: generic specification
Crystalline silicon terrestrial photovoltaic (PV) modules. Design qualification and type approval
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)
Complete filter units for radio interference suppression Blank detail specification. Passive electromagnetic suppression. Filters which safety tests are required (Assessment level D/DZ)
Complete filter units for radio interference suppression Blank detail specification. Passive electromagnetic suppression. Filters which safety tests are required (safety only)
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
IEEE Standard Graphic Symbols for Logic Functions (Including and incorporating IEEE Std 91a-1991, Supplement to IEEE Standard Graphic Symbols for Logic Functions)
€216.00
