Essais d'environnement - Partie 2-21 : essais - Essai U : robustesse des sorties et des dispositifs de montage incorporés
€153.00
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
€193.00
Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-602 : lignes directrices pour un empilement de modules électroniques - Méthode d'évaluation de la connectivité électrique entre modules
€95.67
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
€325.00
Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
€88.00
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on
€316.00
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019); German version EN IEC 62878-2-5:2019
€157.10
Circuit boards and circuit board assemblies - Design and use - Part 6-1 : land pattern design - Generic requirements for land pattern on circuit boards - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-1 : Conception de la zone de report - Exigences génériques pour la zone de report sur les cartes à circuit imprimé
€126.00
Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
€269.00
IEC TR 61191-8:2021 Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
€286.00
Surface mounting technology Standard method for the specification of components through-hole reflow (THR) soldering
Surface mounting technology - Part 3 : Standard method for the specification of components for through hole reflow (THR) soldering
