Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
€176.00
Endurance test methods for die attach materials Temperature cycling method applied to discrete type power electronic devices
€269.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022
€98.32
Méthodes d'essai d'endurance pour les matériaux de fixation de puce - Partie 2 : méthode d'essai de cycle thermique pour les matériaux de fixation de puce, appliquée aux dispositifs électroniques de puissance de type discret
€111.67
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
€23.00
BS EN IEC 60068-2-83. Environmental testing Part 2-83. Tests. Test Tf. Solderability of electronic omponents for surface mounting devices (SMD) by the wetting balance method using solder paste
BS EN IEC 60068-2-88. Environmental Testing Part 2-88. Tests. Test XD. Resistance of components and assemblies to liquid cleaning media
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit for use in automotive applications. Best practices
€404.00
Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
€418.00
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021
€116.64
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021); German version EN IEC 61189-2-807:2021
€77.20
Méthodes d'essai d'endurance pour les matériaux de fixation de puce - Partie 5 : méthodes d'essai de cycle thermique pour les matériaux de fixation de puce (système d'interconnexion par brasage), appliquées aux dispositifs électroniques de puissance de type module
€80.50
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling method (near chip interconnection) module type
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
€316.00
Assurance produit des projets spatiaux - Soudure haute fiabilité pour les connexions électriques à montage en surface, à technologie combinée et montées à la main
€241.50
